flip chip bga 在 小熊的財報夢囈- 景碩(3189) **a. 依照IC與載板連接方式不同 的評價 依照IC與載板連接方式不同，分為覆晶載板（Flip Chip, FC）、導線架載板（Wire ... CSP），後者的封裝面積較小，以封裝I/O腳數多寡排列，通常是FC-BGA ... ... <看更多>
flip chip bga 在 Why does the underside of this flip-chip BGA have small ... 的評價 I think the links were to tie the pads together for plating. Every single pad once had a connection to the outside if I am correct. ... <看更多>
